Style: WSON86X5 Package overview An 8pin WSON package with a 6x5 mm body designed for surfacemount assembly. Key benefits Compact footprint: minimizes board space and enables density PCB layouts. SMT friendly: compatible with standard reflow soldering processes for reliable manufacturing. Low profile option: supports slim, lightweight device designs. Flexible use: suitable for a variety of 8pin ICs that require a small, robust package. Predictable footprint: straightforward to design land patterns around the WSON86X5 style. Attributes Function: 8pin package footprint for small integrated circuits. Compatibility: designed for devices that use the WSON86X5 footprint; verify land pattern and pinout in your device datasheet. Size: body dimensions 6 mm by 5 mm; 8 total leads/pads. Material: standard WSON packaging materials suitable for surfacemount use. Performance: enables compact module designs with reliable electrical connections and straightforward assembly. Use scenarios In a compact environmental sensor module where space is constrained but 8 electrical connections are required. In wearable devices or smart accessories that demand a lowprofile, spacesaving IC package. On a density development board or multichannel module where saving board area without sacrificing connectivity is important.