Feature: 1. Semiconductor cooler, can both refrigerate and heat. The cooling efficiency is generally 55‑60%, but the heating efficiency is very high and always greater than 1. Therefore, using a single piece can replace separate refrigeration and heating systems. 2. It does not need any refrigerant, it can work continuously, there is no pollution source, no rotating parts, no rotation effect, no sliding parts, no vibration or noise during work, and easy installation. 3. Semiconductor cool plate is a current‑transducer type chip. Through the control of input current, high‑precision temperature control can be realized. Coupled with temperature detection and control means, it is easy to realize remote control, program control, and computer control to form an automatic control system. 4. The thermal inertia is very small, fast cooling and heating time. When the hot end has good heat dissipation and the cold end is empty, the cooling plate can up to the maximum temperature difference in less than one minute. 5. The reverse use of semiconductor refrigeration fins is thermoelectric power generation. Semiconductor refrigeration fins are generally suitable for power generation in the middle and low temperature areas. 6. Power of a single refrigeration component pair is very small, but it is combined into a electric pile. If the same type of electric pile is used in series and parallel to form a refrigeration system, the power can be very large, so the cooling power can be up to several milliwatts. The range of ten thousand watts. 7. Temperature resistance is 80℃ for normal temperature hot side, 150℃ for medium temperature hot side, and 200℃ for high temperature hot side; the temperature difference between the hot side and the cold side can up to 67℃ in the first stage, and 80℃ in the second stage. The third level reaches 90℃, and the fourth level reaches 107℃. Specification: Item Type: Thermoelectric Cooler Material: Ceramic Model: TEC2-25408 Rated Voltage: DC12V Maximum Voltage: DC15V (Th=30℃) Maximum Current: 8A (U=15V, Th=30℃) Maximum Temperature Difference: 80℃(Qc=0,Th=30℃) Maximum Cooling Capacity: 44.2W (△T=0℃,Th=30℃) Internal Resistance: 1.4-1.8Ω Lead Specification: 20AWG, L=300mm Packaging Process: 704 Silicone Rubber Sealing Assembly Pressure: 4kg Working Temperature: -50-+80℃ Storage Temperature: -40-+60℃ Size: Approx. 40x40mm / 1.6x1.6in Application Range: 1. Applications in high-tech fields: satellites, semiconductor lasers, infrared thermal imaging, infrared detectors, optoelectronic devices, etc. 2. Home appliance applications: dehumidifiers, portable heating and cooling boxes, hot and cold water dispensers, cold drink cups, beverage wine coolers, etc. 3. Application in electronic technology: cooling of electronic equipment, electronic components, computers, etc. 4. Industrial applications: automobile refrigerators, small air conditioners, dehumidifiers, thermostats, petroleum testing instruments, etc. 5. Medicine, agricultural and biological applications: physical cooling pads, semiconductor physiological slices, vaccine preservation, etc.. Package List: 1 x Semiconductor Cool Plate Note: 1. Please allow 0‑1 inch error due to manual measurement. Thanks for your understanding.2. Monitors are not calibrated same, item color displayed in photos may be showing slightly different from the real object. Please take the real one as standard.