Product Description: SFD‑230 Environmentally Friendly Low Temperature LED Solder Paste for BGA and Mobile Phone Repair Exceptional Printing Performance: The SFD‑230 solder paste offers strong continuous printing performance, making it ideal for welding fine pitch ICs, BGA, and other precise components. Its formulation ensures consistent application, crucial for high-precision tasks. Superior Wettability and Mold Release: This solder paste boasts excellent wettability and mold release properties. It is designed to resist both cold and hot collapse, maintaining its integrity under various temperature conditions. Additionally, it is dry-resistant, ensuring reliable performance in diverse environments. Perfect for High-Precision PCB Welding: Suitable for PCB welding with high-requirement materials, this paste excels with fine pitch and high-precision components. It minimizes issues such as shifting and short tombstoning, ensuring a clean and accurate soldering process. Bright and Clean Finish: The SFD‑230 produces a full, bright tin bead finish with minimal residue. The residue is less white and transparent, ensuring a neat appearance. Importantly, it contains no strong corrosive substances like fluorine, making it safer for both the user and the components. Active and Rinse-Free Formula: This solder paste is active and rinse-free, leaving less residual material behind. It is high in antioxidants, which helps protect the soldered joints from oxidation, ensuring long-lasting durability and reliability. Choose the SFD‑230 Environmentally Friendly Low Temperature LED Solder Paste for your mobile phone and BGA repair needs, and experience superior performance with an eco-friendly touch.