Key benefits Fast heating capacity: Quickly reaches glue removal temperatures between 160 and 250°C, improving efficiency in mobile phone tasks. Broad chip compatibility: Suitable for over 99% of chips, including CPUs and power ICs found in mobile phones and computers, covering diverse needs. Flexible clamping mechanism: The fixture design allows secure clamping of various motherboard shapes, providing stable handling during repairs. Safe and user friendly operation: Low voltage heating plate reduces risk for beginners, and realtime temperature is shown via LED indicators for precise control. Use scenarios Smartphone motherboard service: Efficiently remove glue and rework components during screen replacements or batteryrelated repairs without excessive handling. Laptop and PC motherboard : Clamp different motherboard layouts securely and target CPUs or power ICs for replacement or rework with controlled heating. Tablet and desktop board maintenance: Perform glue removal and component rework on tablets or desktop boards, leveraging stable clamping and visible temperature feedback. Specifications and features Heating temperature range: 160–250°C Chip compatibility: Supported for over 99% of CPUs and power ICs in mobile devices and computers Clamping mechanism: Enables secure handling across various motherboard shapes during repairs Safety and usability: Low voltage heating plate and LED temperature indicators for realtime monitoring