Features: The BGA24 chip with a spacing of 1.0mm is suitable for two types of pin matrices (6x8MM): 6x4 and 5x5, requiring different limit boxes. Before taking a photo, measure the chip size; Using a Ushaped ejector pin for more stable contact (see diagrambelow); The housing of theseat is made of special engineering plastic, which has high strength and long service life; The shrapnel is made of imported berylliumcopper material, with low impedances and good elasticity; Thickened gold plating layer, thickened electroplating of contacts, low contact impedances, high reliability; Specifications: 1. Material (1) InsulatorPEI, andPPS (2) Shrapnel, Be Cu Gold plating (30) μ) Over Nickel Plating (50 μ) 2. Electrical characteristics (1) Insulation resistance: 1000mΩMin, At DC500V (2) Voltage withstand 700AC (3) Contact impedances less than 25mΩ (4) PIN pin elasticity 55g/PIN (Normal) (5) Mechanical life 100000Times (6) Working temperature: -65 ℃~155 ℃ Size：Mixed Package Includes: 1PC BGA24 to DIP8 IC Socket note: Due to manual measurement, please allow an error of 0-1cm. Please make sure you do not mind before bidding. Due to the difference of different monitors, the picture may not reflect the actual color of the item. Thanks!