RF chip: CC2530F256+CC2591 Carrier frequency: 2.4GHz Transmit power: 2. 5mW Communication distance: 800 meters Chip Description: The CC2530F256 is a true system-on-a-chip (SoC) solution for 2.4-GHz lEEE 802.15.4, ZigBee and RF4CE applications. It builds powerful network nodes at a very low total material cost; it provides a powerful and complete ZigBee solution. Name: Wireless PA Module Z- 0002 ZigBee wireless module basic parameters: ZigBee Wireless: 1. Wireless standard: 802.15.4 protocol 2. Frequency range: 2.405GHz~ 2.480GHz 3. Transmitting power: programmable up to 21dBm. 4. ZigBee protocol: ZigBee protocol stack (Z-Stack) 5. Receive sensitivity: -97dBm@250kbps 6. Antenna: 2.4G antenna with external SMA interface 7. Transmission distance: open visual distance up to 800m (PA maximum transmission power 21dBm) PCB board: 1. Number of layers: 4 layers 2. Size: 36.0 x 25.6 mm PCB board 3. Interface: Standard 2.54mm pin header Module hardware parameters: 1. Working voltage: 2.0V- -3.6V 2. Working current: emission current 30mA@21dBm; receiving current 26mA (average current) 3. Working temperature: -40 °C - - 85 C (industrial grade) 4. Storage temperature: -40C- -125°C 5. Transmission rate: wireless transmission rate up to 250kbps 6. Resources: All I/O resources of CC2530 are drawn out, which is convenient for secondary development. Colour: blue Material: PCB Package Contents: 2 x wireless PA module 2 x antenna